Head of Process Integration

We’re seeking a seasoned leader of Process Integration for leading fabless company in Semiconductor. This role will head the company’s Process Integration team, responsible for new BCD technology development and technology Transfer.
 
Responsibilities:

• Lead, develop and motivate the PI (Process Integration) team to drive the engineering excellence.
• Responsible for next-generation BCD technology development and mainstream technology transfer.
• Work closely with wafer foundries to develop new modules and solve process issues.
• Plan and execute projects, conducting cross-team communications and propose solutions to  solve various process/engineering issues (process weaknesses, instabilities, marginalities).
• Co-work with design, product and IP team for products qualification, IP characterization, low yield trouble shooting and let products be introduced into mass production.

Requirements:

• 12+ years of working experience in semiconductor’s process integration and product/device technology development, handling various process technologies in the wafer-foundry and/or chip manufacturing companies.  
• Familiar with BCD technology and power products.
• Able to manage projects and strategic activities independently and execute them successfully.
• Self-motivated, responsible and being willing to deal with difficulties. 
• Good written and verbal communication skills along with well-developed interpersonal skills to influencing others.
• Master's degree in electrical engineering or related studies 

 
 
For more information and a confidential conversation, please email your professional CV to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.