Posted on: 2022-08-05

Job type: Permanent

Sector: Semiconductor

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We’re looking for an experienced Process Integration Lead/Head who’s familiar with 28nm logic technology process integration on 12-inch wafers. This position will be based in Hsin-Chu, Taiwan, reporting to the VP of Engineering.   
  • 28nm (or beyond) logic technology process integration, characterization, and tape-out related coordination
  • Design test key and process monitor key. Process to meet performance and reliability requirements
  • Characterization of logic core/IO devices, layout dependence effect, derivative and SRAM devices
  • Design rule and LOP documentation; command files with CAD team
  • Work with module/device/test/CAD/design/reliability teams
  • Build and develop a new Process Integration team from scratch
  • 10+ years of experience in Process Integration within a wafer foundry environment with minimum 3 years in 28nm/49nm (or beyond) technology.  
  • 12-inch wafer experience is a must.    
  • Preferably 3~10 years as a people manager.
  • Master/Ph.D. degrees in the fields of Electronics/Electrical/Chemical/Physics/Material.   
  • Good command of English
  • Strong mobility. Able to conduct overseas travels 30%-40% of the time for technology transfers.  

Qualified and interested Parties please apply with your CV in Word format to Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.
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Apply for Process Integration Lead (12" wafer, 28nm)
Reference: GC843401

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