Posted on: 2022-08-05

Job type: Permanent

Sector: Semiconductor

 
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We’re looking for an experienced Process Integration Lead/Head who’s familiar with 28nm logic technology process integration on 12-inch wafers. This position will be based in Hsin-Chu, Taiwan, reporting to the VP of Engineering.   
 
Responsibilities:
  • 28nm (or beyond) logic technology process integration, characterization, and tape-out related coordination
  • Design test key and process monitor key. Process to meet performance and reliability requirements
  • Characterization of logic core/IO devices, layout dependence effect, derivative and SRAM devices
  • Design rule and LOP documentation; command files with CAD team
  • Work with module/device/test/CAD/design/reliability teams
  • Build and develop a new Process Integration team from scratch
 
Requirements:
  • 10+ years of experience in Process Integration within a wafer foundry environment with minimum 3 years in 28nm/49nm (or beyond) technology.  
  • 12-inch wafer experience is a must.    
  • Preferably 3~10 years as a people manager.
  • Master/Ph.D. degrees in the fields of Electronics/Electrical/Chemical/Physics/Material.   
  • Good command of English
  • Strong mobility. Able to conduct overseas travels 30%-40% of the time for technology transfers.  

Qualified and interested Parties please apply with your CV in Word format to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.
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Apply for Process Integration Lead (12" wafer, 28nm)
Reference: GC843401

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