Process Integration Lead (12" wafer, 28nm)
HsinChu
Taiwan
Posted on: 2022-08-05
Job type: Permanent
Sector: Semiconductor
We’re looking for an experienced Process Integration Lead/Head who’s familiar with 28nm logic technology process integration on 12-inch wafers. This position will be based in Hsin-Chu, Taiwan, reporting to the VP of Engineering.
Responsibilities:
Requirements:
Qualified and interested Parties please apply with your CV in Word format to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.
Responsibilities:
- 28nm (or beyond) logic technology process integration, characterization, and tape-out related coordination
- Design test key and process monitor key. Process to meet performance and reliability requirements
- Characterization of logic core/IO devices, layout dependence effect, derivative and SRAM devices
- Design rule and LOP documentation; command files with CAD team
- Work with module/device/test/CAD/design/reliability teams
- Build and develop a new Process Integration team from scratch
Requirements:
- 10+ years of experience in Process Integration within a wafer foundry environment with minimum 3 years in 28nm/49nm (or beyond) technology.
- 12-inch wafer experience is a must.
- Preferably 3~10 years as a people manager.
- Master/Ph.D. degrees in the fields of Electronics/Electrical/Chemical/Physics/Material.
- Good command of English
- Strong mobility. Able to conduct overseas travels 30%-40% of the time for technology transfers.
Qualified and interested Parties please apply with your CV in Word format to Janet.Yeh@morganphilips.com. Please note, that while Morgan Philips welcomes and appreciates all candidate response, volume of replies allows us to respond to short-listed candidates only. Resumes are collected for recruitment purposes only.